{"product_id":"hb-fuller-bacon-adhesives-fa-8-ba-9","title":"HB Fuller Bacon Adhesives FA-8\/BA-9","description":"\u003c!-- 1. TITLE OPTIMIZATION (H1) --\u003e\n\u003cdiv class=\"aerospace-product-description\"\u003e\n\u003cp\u003e\u003cstrong\u003eHB Fuller Bacon Adhesives FA-8\/BA-9\u003c\/strong\u003e is a highly filled, two-component, thermally conductive epoxy adhesive and potting compound engineered specifically for high-reliability aerospace, defense, and microelectronic encapsulation applications. Formulated with a liquid epoxy resin (FA-8) and a specialized activator\/hardener (BA-9), this system cures to form a rigid, thermally efficient, and chemically inert structural bond. Designed to dissipate localized heat away from sensitive avionics components while maintaining superior electrical insulation, FA-8\/BA-9 offers excellent dimensional stability, low outgassing characteristics, and high mechanical strength across wide operational thermal ranges. Ideal for potting transformers, staking circuit board components, and bonding electronic substrates in flight deck avionics and missile guidance systems.\u003c\/p\u003e\n\u003chr\u003e\n\u003ch3\u003eTechnical Specifications \u0026amp; Chemical Properties\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eManufacturer \/ Brand:\u003c\/strong\u003e HB Fuller \/ Bacon Adhesives\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eProduct Name \/ Part Number:\u003c\/strong\u003e FA-8 (Resin Base) \/ BA-9 (Activator \/ Hardener)\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eChemical System:\u003c\/strong\u003e Two-Part Filled Epoxy Resin System\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMix Ratio (Resin to Hardener):\u003c\/strong\u003e 100 : 10 by weight (FA-8 : BA-9)\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThermal Conductivity:\u003c\/strong\u003e High thermal dissipation properties designed for heat-sink bonding and electrical encapsulation\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eElectrical Insulation \/ Dielectric Properties:\u003c\/strong\u003e High volume resistivity and dielectric strength to prevent electrical breakdown in high-density electronics\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eViscosity:\u003c\/strong\u003e Thixotropic paste consistency (resists sagging during vertical application and cure)\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOperating Temperature Range:\u003c\/strong\u003e -65°F to 300°F (-54°C to 149°C) post-cure continuous service\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCure Schedule:\u003c\/strong\u003e Heat-accelerated cure profile (typically cured at 160°F to 200°F \/ 71°C to 93°C for maximum cross-linking density)\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eColor:\u003c\/strong\u003e Off-white \/ Cream to Amber paste\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eApproved Specifications \u0026amp; Aerospace Conformance:\u003c\/h3\u003e\n\u003cp\u003eHB Fuller Bacon Adhesives FA-8\/BA-9 meets or exceeds strict microelectronic, space, and airframe defense standards:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eNASA Outgassing Conformance:\u003c\/strong\u003e Meets low volatile outgassing requirements (TML \u0026lt; 1.0%, CVCM \u0026lt; 0.10%) per ASTM E595 for high-vacuum and spaceborne electronic packaging.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMilitary Avionics Qualified:\u003c\/strong\u003e Qualified across major defense and aerospace OEM process standards for component staking and power supply potting.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHigh Chemical Resistance:\u003c\/strong\u003e Resists breakdown from synthetic lubricating oils, hydraulic fluids, and electronic cleaning solvents.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003chr\u003e\n\u003ch3\u003eKey Features \u0026amp; Performance Benefits\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eThermal Management \u0026amp; Heat Dissipation:\u003c\/strong\u003e Efficiently transfers heat away from high-power microelectronic components to heat sinks, preventing thermal damage.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHigh Dielectric \u0026amp; Electrical Isolation:\u003c\/strong\u003e Protects delicate circuitry against electrical shorting, tracking, and environmental arc-over.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLow Thermal Expansion (CTE):\u003c\/strong\u003e Matched CTE minimizes mechanical stress on glass-sealed components, solder joints, and silicon chips during thermal cycling.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThixotropic Non-Sag Paste:\u003c\/strong\u003e Stays in place during application and heat curing, making it ideal for vertical component staking and filleting.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003chr\u003e\n\u003ch3\u003eTypical Applications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eAvionics Component Stacking \u0026amp; Filleting:\u003c\/strong\u003e Secures capacitors, resistors, and transformers to printed circuit boards (PCBs) to withstand high launch and flight vibration.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePower Supply \u0026amp; Sensor Potting:\u003c\/strong\u003e Encapsulates coils, sensors, transducers, and power modules in missile guidance, radar, and satellite systems.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eStructural Heat Sink Bonding:\u003c\/strong\u003e Bonds electronic packages to aluminum cold plates and chassis in flight deck display computers and electronic warfare suites.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e","brand":"HB Fuller","offers":[{"title":"Quart Kit","offer_id":56511359582580,"sku":"FA-8B-BA9-QT","price":807.69,"currency_code":"USD","in_stock":true}],"url":"https:\/\/145.aero\/products\/hb-fuller-bacon-adhesives-fa-8-ba-9","provider":"Aircraft Shop Supply","version":"1.0","type":"link"}